CHIP-SUBSTRAT-VERBUNDHALBLEITERBAUELEMENT

Patent europeic · EP3944290 · En vigur

Inscripziun en il register

Numer da publicaziun
EP3944290
Numer da la dumonda
EP20186986
Gener
Patent europeic cun effect per la Svizra ed il Liechtenstein
Status
En vigur
Scrittira da patent
Concedì
Annunzià
21-07-2020
Publitgà
26-01-2022
Concedì
11-02-2026
La protecziun finescha il pli tard
20-07-2040
Proxima taxa annuala scadenta
31-07-2026
Classas IPC
H01L 21/48 (2006.01)
H01L 23/498 (2006.01)
Lingua da l’annunzia
englais
Funtauna
Swissreg

Istorgia

Quai che l’Institut federal da la proprietad intellectuala ha publitgà davart quest titel, il pli nov l’emprim.

  1. 11-02-2026

    Concedì

    Specification status
    Non-published patent application → Granted patent
    Status of protective title
    Initiated → Active

    Published in Swissreg on 11.02.2026

Partidas

Possessur

Infineon Technologies Austria AG

Siemensstr. 2, 9500 Villach, AT

Inventur

FACHMANN, Christian

9586 Fürnitz, AT

RIEGLER, Andreas

9241 Lichtpold, AT

GLANZER, Barbara Angela

9020 Klagenfurt, AT

Il register numna mintga partida cun num ed adressa. In possessur u in represchentant vegn collià cun in’organisaziun, sch’exact ina unitad giuridica dal register da commerzi porta ses num; la via d’ina partida betg enconuschida uschia na vegn betg mussada qua.