BONDDRAHT FÜR HALBLEITERBAUELEMENTE
Patent europeic · EP4174202 · En vigur
Inscripziun en il register
- Numer da publicaziun
- EP4174202
- Numer da la dumonda
- EP22798228
- Gener
- Patent europeic cun effect per la Svizra ed il Liechtenstein
- Status
- En vigur
- Scrittira da patent
- Concedì
- Annunzià
- 16-03-2022
- Publitgà
- 03-05-2023
- Concedì
- 17-06-2026
- La protecziun finescha il pli tard
- 15-03-2042
- Proxima taxa annuala scadenta
- 31-03-2027
- Classas IPC
- C22C 9/00 (2006.01)C22C 19/03 (2006.01)B32B 15/01 (2006.01)C22C 5/04 (2006.01)C22C 19/00 (2006.01)B23K 35/02 (2006.01)B23K 35/30 (2006.01)C22C 1/02 (2006.01)
- Prioritad
- JP 2021105514 25.06.2021
- Dumonda PCT
- PCT/JP2022/012032 16.03.2022
- Publicaziun PCT
- WO2022/270050 29.12.2022
- Lingua da l’annunzia
- giapunais
- Funtauna
- Swissreg
Istorgia
Quai che l’Institut federal da la proprietad intellectuala ha publitgà davart quest titel, il pli nov l’emprim.
- 17-06-2026
Concedì
- Specification status
- Non-published patent application → Granted patent
- Status of protective title
- Initiated → Active
Published in Swissreg on 17.06.2026
Partidas
Inventur
ODA, Daizo
Iruma-shi Saitama 358-0032, JP
ETO, Motoki
Iruma-shi Saitama 358-0032, JP
YAMADA, Takashi
Iruma-shi Saitama, 358-0032, JP
HAIBARA, Teruo
Iruma-shi Saitama 358-0032, JP
OISHI, Ryo
Iruma-shi Saitama 358-0032, JP
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