Verbindungs- und Aufbautechnik für Multichip-Module
European patent · EP0690494 · Deleted
Register entry
- Publication number
- EP0690494
- Application number
- EP95109271
- Kind
- European patent with effect for Switzerland and Liechtenstein
- Status
- Deleted
- Specification
- Granted
- Filed
- Jun 14, 1995
- Published
- Jan 3, 1996
- Granted
- Mar 17, 2004
- Deleted
- Jun 30, 2009
- Reason
- Annual fee unpaid
- IPC classes
- H01L 21/768 (2006.01)H01L 23/52 (2006.01)H05K 3/46 (2006.01)
- Priority
- DE 4422345 27.06.1994
- Filing language
- German
- Source
- Swissreg
History
What the Federal Institute of Intellectual Property published about this title, newest first.
- Jan 20, 2010
Deleted, fee unpaid
Published in Swissreg on 20.01.2010
- Apr 30, 2004
Agent entered
- Representative
- Infineon Technologies Schweiz AG, Badenerstrasse 623, 8048 Zürich
Published in +pat+ No 8 in 2004
- Mar 31, 2004
Granted
Published in +pat+ No 6 in 2004
Parties
Inventor
Leuschner, Rainer, Dr.
D-91056 Erlangen, DE
Ahne, Hellmut, Dr.
D-91341 Röttenbach, DE
Birkle, Siegfried, Dr.
D-91315 Höchstadt/Aisch, DE
Hammerschmidt, Albert, Dr.
D-91056 Erlangen, DE
Sezi, Recai, Dr.
D-91341 Röttenbach, DE
Noll, Tobias, Prof. Dr.
D-52072 Aachen, DE
Dumoulin, Ann, Dr.
B-8210 Zedelgem, BE
The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.