Matières moulables pour l'encapsulage d'éléments électroniques

European patent · EP0135310 · Deleted

Register entry

Publication number
EP0135310
Application number
EP84305087
Kind
European patent with effect for Switzerland and Liechtenstein
Status
Deleted
Specification
Granted
Filed
Jul 26, 1984
Published
Mar 27, 1985
Granted
Jan 15, 1992
Deleted
Jul 31, 1993
Reason
Annual fee unpaid
IPC classes
C08L 67/02 (2006.01)
C08L 67/04 (2006.01)
C08L 77/12 (2006.01)
C08K 3/36 (2006.01)
Priority
US A 517870 27.07.1983
US A 619608 18.06.1984
Filing language
English
Source
Swissreg

History

What the Federal Institute of Intellectual Property published about this title, newest first.

  1. Oct 25, 2024

    Deleted, fee unpaid

    Published in Swissreg on 25.10.2024

  2. Feb 28, 1992

    Granted

    Published in PIDTJ No 4 in 1992

Parties

Inventor

Eickman, Nancy C.

Mountainside New Jersey, US

McChesney, Charles E.

Monmouth Junction New Jersey, US

Williams, Gary E.

Short Hills New Jersey, US

Yoon, Hyun-Nam

Summit New Jersey, US

The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.