Procede d'interconnexion verticale au sein de modules electroniques 3D utilisant des vias

European patent · EP2053646 · Deleted

Register entry

Publication number
EP2053646
Application number
EP08167277
Kind
European patent with effect for Switzerland and Liechtenstein
Status
Deleted
Specification
Granted
Filed
Oct 22, 2008
Published
Apr 29, 2009
Granted
Aug 18, 2010
Deleted
Oct 31, 2012
Reason
Annual fee unpaid
IPC classes
H01L 25/10 (2006.01)
H01L 21/98 (2006.01)
H01L 23/58 (2006.01)
//H01L 21/56 (2006.01)
//H01L 21/60 (2006.01)
Priority
FR 0707557 26.10.2007
Filing language
French
Source
Swissreg

History

What the Federal Institute of Intellectual Property published about this title, newest first.

  1. May 22, 2013

    Deleted, fee unpaid

    Published in Swissreg on 22.05.2013

  2. Aug 18, 2010

    Granted

    Published in Swissreg on 18.08.2010

Parties

Holder

3D Plus

641 Rue Hélène Boucher, Z.I., 78532 Buc Cedex, FR

Inventor

Val, Christian

78470 St Remy Les Chevreuse, FR

The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.