ABBILDUNGSSYSTEME MIT THROUGH-OXIDE-VIA-VERBINDUNGEN

European patent · EP3249691 · Deleted

Register entry

Publication number
EP3249691
Application number
EP17178489
Kind
European patent with effect for Switzerland and Liechtenstein
Status
Deleted
Specification
Granted
Filed
Feb 25, 2015
Published
Nov 29, 2017
Granted
Aug 2, 2023
Deleted
Sep 24, 2024
Reason
Annual fee unpaid
IPC classes
H01L 27/146 (2006.01)
Priority
US 201414191965 27.02.2014
Filing language
English
Source
Swissreg

History

What the Federal Institute of Intellectual Property published about this title, newest first.

  1. Sep 24, 2024

    Deleted, fee unpaid

    Status of protective title
    Active → Cancelled
    Cancellation date
    24.09.2024
    Cause for cancellation
    Non-payment of renewal fee

    Published in Swissreg on 24.09.2024

  2. Jun 12, 2024

    Change

    Published in Swissreg on 12.06.2024

  3. Aug 2, 2023

    Granted

    Published in Swissreg on 02.08.2023

Parties

Holder

Semiconductor Components Industries, LLC

5005 E. McDowell Road, Phoenix, AZ 85008, US

Inventor

Borthakur, Swarnal

Boise, ID 83706, US

Sulfridge, Marc

Boise, ID 83713, US

Korobov, Vladimir

San Mateo, CA 94402, US

The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.