MODULARES PCB-GEHÄUSE MIT ERDUNGSKLEMME

European patent · EP3281501 · Deleted

Register entry

Publication number
EP3281501
Application number
EP15797557
Kind
European patent with effect for Switzerland and Liechtenstein
Status
Deleted
Specification
Granted
Filed
Nov 10, 2015
Published
Feb 14, 2018
Granted
Dec 30, 2020
Deleted
Jul 1, 2022
Reason
Annual fee unpaid
IPC classes
H05K 7/14 (2006.01)
H01R 9/26 (2006.01)
H01R 13/11 (2006.01)
H01R 4/64 (2006.01)
Priority
US 201562145233 P 09.04.2015
PCT application
PCT/US2015/059824 10.11.2015
PCT publication
WO2016/164070 13.10.2016
Filing language
English
Source
Swissreg

History

What the Federal Institute of Intellectual Property published about this title, newest first.

  1. Jul 1, 2022

    Deleted, fee unpaid

    Published in Swissreg on 01.07.2022

  2. Nov 10, 2021

    Change

    Published in Swissreg on 10.11.2021

  3. Dec 30, 2020

    Granted

    Published in Swissreg on 30.12.2020

Parties

Inventor

FRYE, Scott, Michael

Palmyra, PA 17078, US

BARBER, Terry, Lee

Harrisburg, PA 17111, US

KLINGER, Stephen, Craig

Hummelstown, PA 17036, US

KEPHART, Talon, Coe

Lancaster, PA 17603, US

WYNN, Matthew, J.

Elizabethtown, PA 17022, US

BRODBECK, Craig, Alan

Lancaster, PA 17603, US

The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.