IC CHIP BEHANDLUNG

European patent · EP3613073 · Deleted

Register entry

Publication number
EP3613073
Application number
EP18787931
Kind
European patent with effect for Switzerland and Liechtenstein
Status
Deleted
Specification
Granted
Filed
Apr 2, 2018
Published
Feb 26, 2020
Granted
Jul 10, 2024
Deleted
Nov 25, 2025
Reason
Annual fee unpaid
IPC classes
H01L 21/67 (2006.01)
H01L 21/683 (2006.01)
H01L 25/065 (2023.01)
H01L 21/98 (2006.01)
Priority
US 201762488340 P 21.04.2017
US 201762563847 P 27.09.2017
US 201815936075 26.03.2018
PCT application
PCT/US2018/025694 02.04.2018
PCT publication
WO2018/194827 25.10.2018
Filing language
English
Source
Swissreg

History

What the Federal Institute of Intellectual Property published about this title, newest first.

  1. Nov 25, 2025

    Deleted, fee unpaid

    Status of protective title
    Active → Cancelled
    Cancellation date
    25.11.2025
    Cause for cancellation
    Non-payment of renewal fee

    Published in Swissreg on 25.11.2025

  2. May 21, 2025

    Change

    Published in Swissreg on 21.05.2025

  3. Jul 10, 2024

    Granted

    Published in Swissreg on 10.07.2024

Parties

Holder

Adeia Semiconductor Bonding Technologies Inc.

3025 Orchard Parkway, San Jose, CA 95134, US

Inventor

UZOH, Cyprian, Emeka

San Jose, CA 95134, US

The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.