BONDDRAHT FÜR HALBLEITERBAUELEMENTE

European patent · EP4174202 · In force

Register entry

Publication number
EP4174202
Application number
EP22798228
Kind
European patent with effect for Switzerland and Liechtenstein
Status
In force
Specification
Granted
Filed
Mar 16, 2022
Published
May 3, 2023
Granted
Jun 17, 2026
Protection ends at the latest
Mar 15, 2042
Next annual fee due
Mar 31, 2027
IPC classes
C22C 9/00 (2006.01)
C22C 19/03 (2006.01)
B32B 15/01 (2006.01)
C22C 5/04 (2006.01)
C22C 19/00 (2006.01)
B23K 35/02 (2006.01)
B23K 35/30 (2006.01)
C22C 1/02 (2006.01)
Priority
JP 2021105514 25.06.2021
PCT application
PCT/JP2022/012032 16.03.2022
PCT publication
WO2022/270050 29.12.2022
Filing language
Japanese
Source
Swissreg

History

What the Federal Institute of Intellectual Property published about this title, newest first.

  1. Jun 17, 2026

    Granted

    Specification status
    Non-published patent application → Granted patent
    Status of protective title
    Initiated → Active

    Published in Swissreg on 17.06.2026

Parties

Inventor

ODA, Daizo

Iruma-shi Saitama 358-0032, JP

ETO, Motoki

Iruma-shi Saitama 358-0032, JP

YAMADA, Takashi

Iruma-shi Saitama, 358-0032, JP

HAIBARA, Teruo

Iruma-shi Saitama 358-0032, JP

OISHI, Ryo

Iruma-shi Saitama 358-0032, JP

The register names each party by name and address. A holder or agent is linked to an organization where exactly one entity of the commercial register bears its name; the street of a party not so recognised is not shown here.